The VDI G and W Band Diode Products are abrupt junction diodes. Typical forward current vs. voltage (IV) curves are shown on each specification for the customer's convenience. The following are explanations of the parameters listed on the diode specifications with the exception of the W Band ZBD which has explanations listed on its specification:
Agilent ADS, AWR Corp. MWO (Microwave Office), and Agilent Genesys models for the W Band Single Anode and W Band ZBD diodes can be accessed at the Modelithics, Inc. website.
Contact [email protected] with any additional questions.
VDI is currently accepting resumes for a Micro Assembly Technician. Two years Electronics Technician degree or equivalent/similar experience is preferred. Experience working under a microscope with microelectronics is preferred. Retirement and health benefits provided. EOE. Send resume to [email protected].
VDI is currently accepting resumes for a Millimeter Wave Engineer. BScEE preferred. Job involves RF Engineering activities related to the production and testing of 100-1000Ghz Transmitters and Receivers. Recent grads are encouraged to apply. Retirement and health benefits provided. EOE. Send resume to [email protected].
VDI is currently accepting resumes for a Electrical Engineer. BScEE preferred. Job involves RF Engineering activities related to the production and testing of 100-1000Ghz Transmitters and Receivers. Recent grads are encouraged to apply. Retirement and health benefits provided. EOE. Send resume to [email protected].
The following notes are some general guidelines and details that may be helpful when flip-chip mounting/soldering VDI diodes to circuits. The procedure noted here is essentially the procedure used by VDI. The VDI diode solder contact pads are Au thin films. Process times and temperatures are variable and depend upon the Customer’s circuits or substrates being used. This outline is simply intended to give some general guidelines for diode flip-chip mounting and soldering.
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